[Congressional Bills 119th Congress]
[From the U.S. Government Publishing Office]
[S. 5382 Introduced in Senate (IS)]
<DOC>
119th CONGRESS
2d Session
S. 5382
To require a report on the artificial intelligence power of the
People's Republic of China.
_______________________________________________________________________
IN THE SENATE OF THE UNITED STATES
August 7, 2026
Mr. Husted (for himself and Mr. Warner) introduced the following bill;
which was read twice and referred to the Committee on Foreign Relations
_______________________________________________________________________
A BILL
To require a report on the artificial intelligence power of the
People's Republic of China.
Be it enacted by the Senate and House of Representatives of the
United States of America in Congress assembled,
SECTION 1. SHORT TITLE.
This Act may be cited as the ``China AI Power Report Act''.
SEC. 2. REPORT ON ARTIFICIAL INTELLIGENCE POWER OF THE PEOPLE'S
REPUBLIC OF CHINA.
(a) In General.--Not later than 180 days after the date of the
enactment of this Act, and annually thereafter for 3 years, the
Secretaries, in consultation with the covered agency heads, shall
submit to the appropriate committees of Congress a report on the
advanced artificial intelligence capabilities of the PRC, including the
efforts by the PRC relating to supply chains for advanced artificial
intelligence systems.
(b) Components.--Each report required under subsection (a) shall
also include the following:
(1) An assessment of integrated circuits designed or
optimized for advanced artificial intelligence training or
inference by artificial intelligence chip designers in the PRC,
including Huawei Technologies Co., Ltd. and Cambricon
Technologies (or successor entities), that includes--
(A) with respect to such integrated circuits, the--
(i) total processing power;
(ii) integer and floating point operations
per second at relevant precision levels;
(iii) memory capacity and bandwidth;
(iv) interconnect bandwidth;
(v) power efficiency;
(vi) transistor count and die size;
(vii) process node used per design;
(viii) energy efficiency;
(ix) manufacturing cost and yield
assumptions;
(x) ability of the integrated circuit to
effectively run artificial intelligence models
trained on a different chip designer's
integrated circuit, including measurements such
as model inference in tokens per second and
cost per token with and without a software
application layer that improves model
translation ability;
(xi) the capability of the most advanced
server configuration produced using the chip
designer's integrated circuits including such
technical specifications like floating point
operations per second, memory capacity and
bandwidth, energy efficiency, and ability to
function at scale; and
(xii) any future specification that becomes
relevant to the development of future
artificial intelligence capability; and
(B) with respect to such chip designers--
(i) the total number and types of
integrated circuits produced in the year
preceding submission of such report and the
projected production number for the year
proceeding submission of such report;
(ii) the foundries used in the production
of the integrated circuits;
(iii) the software ecosystem, including any
parallel computing platforms, programming
models, or development frameworks that enable
accelerated computing for artificial
intelligence training or inference;
(iv) the method and extent to which such
integrated circuits are used in other
countries, including in the United States; and
(v) the manufacturer's ability to produce a
software application layer required to achieve
an improved token per seconds and cost per
token rate.
(2) An assessment of semiconductor fabrication facilities
in the PRC that produce logic integrated circuits for use in
advanced artificial intelligence training or inference,
including such facilities owned or operated by the
Semiconductor Manufacturing International Corporation, that
includes, with respect to such facilities, the--
(A) total monthly production capacity per advanced
process node with non-planar transistors or 16/14 nm
and below and the percentage of that monthly production
capacity dedicated to production of logic integrated
circuits for use in advanced artificial training or
inference;
(B) yield for producing such logic integrated
circuits for use in advanced artificial intelligence
training or inference at each facility with an
assessment of that yield in industry relevant terms,
such as compared to PRC firms, compared to non-PRC
firms, or how many are in current industry-leading
datacenters;
(C) most advanced process node under production;
(D) types and volume of semiconductor manufacturing
equipment used, the country of origin for such
equipment, and the export control regulatory regime
under which such equipment was procured;
(E) collaborations, licit or illicit, between PRC
firms or their subsidiaries and non-PRC firms and the
advancements those collaborations produce for the PRC
firm;
(F) progress PRC firms are making at indigenizing
export controlled technologies;
(G) market share PRC firms have in the PRC and
internationally; and
(H) year-over-year trends in leading semiconductor
fabrication facilities during at least the preceding 5-
year period;
(3) An assessment of semiconductor fabrication facilities
in the PRC that produce memory integrated circuits used for
advanced artificial intelligence training or inference,
including such facilities owned or operated by ChangXin Memory
Technologies or Yangtze Memory Technologies Corp., that
includes--
(A) with respect to such circuits, the--
(i) most advanced generation of high-
bandwidth memory, including the technical
specifications and stack height;
(ii) memory cell area and memory density of
other dynamic random access memory integrated
circuits; and
(iii) highest number of layers in three-
dimensional NOT-AND memory integrated circuits;
(B) with respect to such facilities, the--
(i) yield and total monthly production
capacity for memory integrated circuits,
including dynamic random access memory such as
high-bandwidth memory, and NOT-AND memory; and
(ii) types and volume of semiconductor
manufacturing equipment used, including the
country of origin of such equipment and the
export control regulatory regime such equipment
was procured under.
(C) collaborations, licit or illicit, between PRC
firms or their subsidiaries and non-PRC firms and the
advancements those collaborations produce for the PRC
firm;
(D) progress PRC firms are making at indigenizing
export controlled technologies;
(E) market share PRC firms have in the PRC and
internationally; and
(F) year-over-year trends in the PRC's advanced
memory integrated circuit production for a minimum of
the 5 previous years.
(4) An assessment of semiconductor manufacturing equipment
companies in the PRC, including NAURA Technology Group,
KINGSEMI, Advanced Micro-Fabrication Equipment Inc., Shanghai
Micro Electronics Equipment, and Shenzhen SiCarrier
Technologies Co., Ltd, that includes--
(A) a categorical breakdown of annual unit
production volume and technical specifications,
including minimum feature size, throughput, and defect
rate, of all major equipment classes installed or under
development for wafer production in foundries in the
PRC, including--
(i) lithography tools, including
photolithography, nanoimprint, and electron
beam lithography tools;
(ii) etch equipment, including wet etching
and dry etching;
(iii) deposition equipment, including
chemical vapor deposition, physical vapor
deposition, and atomic layer deposition;
(iv) cleaning systems;
(v) chemical mechanical planarization
tools;
(vi) ion implantation and diffusion
systems;
(vii) wafer inspection, metrology, and
process control tools;
(viii) back-end packaging equipment,
including wafer dicing equipment and wire
bonders;
(ix) capabilities and advancements in
advanced packaging technologies;
(x) thermal processing equipment;
(xi) bonding equipment, including thermo
compression bonders and hybrid bonders;
(xii) environmental control systems;
(xiii) laser systems; and
(xiv) reticle and photomask writing and
inspection tools;
(B) the country of origin and supplier company for
each piece of semiconductor manufacturing equipment
used in foundries in the PRC for advanced-node logic or
high-bandwidth memory production by such companies;
(C) the foreign-sourced subcomponents integrated
into the semiconductor manufacturing equipment produced
by such companies, including precision motion stages,
lasers, electrostatic chucks, optical systems, radio
frequency generators, or extreme-purity gas handling
systems;
(D) collaborations, licit or illicit, between PRC
firms or their subsidiaries and non-PRC firms and the
advancements those collaborations produce for the PRC
firm;
(E) progress PRC firms are making at indigenizing
export controlled technologies;
(F) market share PRC firms have in the PRC and
internationally; and
(G) year-over-year trends in leading semiconductor
manufacturing equipment companies in the PRC for a
minimum of the 5 previous years.
(5) An assessment of electronic design automation (EDA)
software used in the design of integrated circuits for advanced
artificial intelligence applications in the PRC, including
software developed or provided by leading PRC EDA companies
such as Empyrean Technology Co., Ltd. and Primarius
Technologies Co., Ltd., that includes--
(A) with respect to such software tools, the--
(i) range of design stages supported,
including front-end design such as architecture
and register-transfer level design, logic
synthesis, verification, physical design,
place-and-route, timing closure, and final
signoff;
(ii) compatibility with advanced process
nodes, including sub-7 nanometer technologies,
gate-all-around devices, and three-dimensional
integration;
(iii) capabilities for designing artificial
intelligence-specific components of such
integrated circuits, including tensor
processing cores, systolic array processing
units, matrix multiplier units, and high-
bandwidth memory interfaces;
(iv) ability to model and optimize for
power, performance, and thermal constraints in
artificial intelligence workloads;
(v) scale and performance of the software
in handling large designs, such as chips
exceeding 50-100 billion transistors; and
(vi) integration with cloud compute
resources or distributed workflows for large-
scale artificial intelligence chip development;
(B) with respect to such companies, the--
(i) total market share within the PRC and
internationally, including the share of
advanced-node integrated circuits designed or
optimized for advanced artificial intelligence
training or inference designs supported by each
company; and
(ii) types, volume, and origin of critical
technology components used in software
development, including intellectual property
cores, third-party libraries, verification
suites, and artificial intelligence-assisted
optimization algorithms;
(C) progress PRC firms are making at indigenizing
export-controlled or foreign-origin technologies used
in EDA, including high-performance computing
integration, advanced verification engines, and
proprietary intellectual property cores;
(D) year-over-year trends for the PRC's EDA
industry over a minimum of the previous 5 years,
including technology adoption, market share, and
software capability evolution; and
(E) identification of technical gaps relative to
leading global EDA providers, particularly in relation
to artificial intelligence-focused design, advanced
nodes, and large-scale verification.
(6) An assessment of the advanced artificial intelligence
models determined by the Secretaries to be the most relevant to
the national security of the United States that were developed
by artificial intelligence laboratories or companies based in
the PRC, especially those laboratories and companies affiliated
with the People's Liberation Army or any university in the PRC,
including the most advanced models, open-weight and closed-
weight models, based on model size, total compute used during
training, benchmark performance, and any other advanced
capabilities the Secretaries determine relevant, that includes,
with respect to each such model--
(A) the number of model parameters;
(B) the total training compute used, measured in
floating-point operations and their relevant precision
level;
(C) the model performance on benchmark tasks;
(D) an evaluation of the extent to which the model
exhibits advanced cyber offensive capabilities, an
advanced understanding of biological and virological
application domains, and the ability to substantially
automate or accelerate artificial intelligence
research, and a comparison of such models to the most
advanced artificial intelligence models from United
States developers;
(E) if the model is open-weight, an evaluation of
the files provided and the security implications of
following the developer's deployment instructions;
(F) a description of the algorithmic alignment
training used;
(G) the type and scale of compute infrastructure
used in training and inference, including the cluster
configurations, the number and type of integrated
circuits specifically designed or optimized for
advanced artificial intelligence training or inference,
how such integrated circuits were acquired and from
which companies, where those clusters are located, and
how they are being accessed;
(H) the manner and extent to which the model is
used throughout society in the PRC, including
throughout the following industries or sectors:
(i) the People's Liberation Army;
(ii) the surveillance and intelligence
collection functions of the CCP, including the
genocide of Uyghur Muslims and other religious
and ethnic minorities in the Xinjiang Uyghur
Autonomous Region;