[Congressional Bills 119th Congress]
[From the U.S. Government Publishing Office]
[H.R. 6275 Introduced in House (IH)]
<DOC>
119th CONGRESS
1st Session
H. R. 6275
To require the Secretary of Commerce to submit a report annually on the
advanced artificial intelligence capabilities of the People's Republic
of China, and for other purposes.
_______________________________________________________________________
IN THE HOUSE OF REPRESENTATIVES
November 21, 2025
Mr. Moylan (for himself, Mr. Vindman, and Mr. Huizenga) introduced the
following bill; which was referred to the Committee on Foreign Affairs
_______________________________________________________________________
A BILL
To require the Secretary of Commerce to submit a report annually on the
advanced artificial intelligence capabilities of the People's Republic
of China, and for other purposes.
Be it enacted by the Senate and House of Representatives of the
United States of America in Congress assembled,
SECTION 1. SHORT TITLE.
This Act may be cited as the ``China AI Power Report Act''.
SEC. 2. SENSE OF CONGRESS.
It is the sense of Congress that--
(1) export controls on artificial intelligence technologies
and related capabilities must be dynamic and adaptive to
effectively address the evolving national security challenges
posed by the People's Republic of China (``China'');
(2) such controls should be regularly updated to reflect
rapid technological innovations, China's advancing
capabilities, and emerging methods of diversion, circumvention,
and avoidance, to ensure the United States maintains its
strategic advantage and to protect the national security
interests of the United States; and
(3) to ensure Congress can exercise oversight and, as
necessary, update export control authorities to enable
necessary updates to export controls, Congress must be kept
fully and currently informed of the current and projected
future states of China's artificial intelligence capabilities.
SEC. 3. REPORT ON ARTIFICIAL INTELLIGENCE POWER OF CHINA.
(a) In General.--Not later than 180 days after the date of the
enactment of this Act, and annually thereafter for 3 years, the
Secretary of Commerce, in consultation with the covered agency heads,
shall submit to the Committee on Foreign Affairs of the House of
Representatives and the Committee on Banking, Housing, and Urban
Affairs of the Senate a report on the advanced artificial intelligence
capabilities of China, including the efforts by China relating to
supply chains for advanced artificial intelligence systems.
(b) Components.--Each report required under subsection (a) shall
also include the following:
(1) An assessment of integrated circuits designed or
optimized for advanced artificial intelligence training or
inference by leading artificial intelligence chip designers in
China, including Huawei Technologies Co., Ltd. and Cambricon
Technologies, that includes--
(A) with respect to such integrated circuits, the--
(i) total processing power;
(ii) integer and floating point operations
per second at relevant precision levels;
(iii) memory capacity and bandwidth;
(iv) interconnect bandwidth;
(v) power efficiency;
(vi) transistor count and die size;
(vii) process node used per design;
(viii) energy efficiency;
(ix) manufacturing cost and yield
assumptions;
(x) ability of the integrated circuit to
effectively run artificial intelligence models
trained on a different chip designer's
integrated circuit, including measurements such
as model inference in tokens per second and
cost per token with and without a software
application layer that improves model
translation ability;
(xi) the capability of the most advanced
server configuration produced using the chip
designer's integrated circuits including such
technical specifications like floating point
operations per second, memory capacity and
bandwidth, energy efficiency, and ability to
function at scale; and
(xii) any future specification that becomes
relevant to the development of future
artificial intelligence capability; and
(B) with respect to such chip designers--
(i) the total number and types of
integrated circuits produced in the year
preceding submission of such report and the
projected production number for the year
proceeding submission of such report;
(ii) the foundries used in the production
of the integrated circuits;
(iii) the software ecosystem, including any
parallel computing platforms, programming
models, or development frameworks that enable
accelerated computing for artificial
intelligence training or inference;
(iv) the method and extent to which such
integrated circuits are used in other
countries, including in the United States; and
(v) the manufacturer's ability to produce a
software application layer required to achieve
an improved token per seconds and cost per
token rate.
(2) An assessment of leading semiconductor fabrication
facilities in China that produce logic integrated circuits for
use in advanced artificial intelligence training or inference,
including such facilities owned or operated by the
Semiconductor Manufacturing International Corporation, that
includes, with respect to such facilities, the--
(A) total monthly production capacity per advanced
process node with non-planar transistors or \16/14\ nm
and below and the percentage of that monthly production
capacity dedicated to production of logic integrated
circuits for use in advanced artificial training or
inference;
(B) yield for producing such logic integrated
circuits for use in advanced artificial intelligence
training or inference at each facility with an
assessment of that yield in industry relevant terms,
such as compared to Chinese firms, compared to non-
Chinese firms, or how many are in current industry-
leading datacenters;
(C) most advanced process node under production;
(D) types and volume of semiconductor manufacturing
equipment used, the country of origin for such
equipment, and the export control regulatory regime
under which such equipment was procured;
(E) collaborations, licit or illicit, between
Chinese firms or their subsidiaries and non-Chinese
firms and the advancements those collaborations produce
for the Chinese firm;
(F) progress Chinese firms are making at
indigenizing export controlled technologies;
(G) market share Chinese firms have in China and
internationally; and
(H) year-over-year trends in leading semiconductor
fabrication facilities during at least the preceding 5-
year period;
(3) An assessment of leading semiconductor fabrication
facilities in China that produce memory integrated circuits
used for advanced artificial intelligence training or
inference, including such facilities owned or operated by
ChangXin Memory Technologies or Yangtze Memory Technologies
Corp., that includes--
(A) with respect to such circuits, the--
(i) most advanced generation of high-
bandwidth memory, including the technical
specifications and stack height;
(ii) smallest half-pitch and the per-die
capacity of other dynamic random access memory
integrated circuits; and
(iii) highest number of layers in three-
dimensional NOT-AND memory integrated circuits;
(B) with respect to such facilities, the--
(i) yield and total monthly production
capacity for memory integrated circuits,
including dynamic random access memory such as
high-bandwidth memory, and NOT-AND memory; and
(ii) types and volume of semiconductor
manufacturing equipment used, including the
country of origin of such equipment and the
export control regulatory regime such equipment
was procured under.
(C) collaborations, licit or illicit, between
Chinese firms or their subsidiaries and non-Chinese
firms and the advancements those collaborations produce
for the Chinese firm;
(D) progress Chinese firms are making at
indigenizing export controlled technologies;
(E) market share Chinese firms have in China and
internationally; and
(F) year-over-year trends in China's advanced
memory integrated circuit production for a minimum of
the 5 previous years.
(4) An assessment of leading semiconductor manufacturing
equipment companies in China, including NAURA Technology Group,
KINGSEMI, Advanced Micro-Fabrication Equipment Inc., Shanghai
Micro Electronics Equipment, and Shenzhen SiCarrier
Technologies Co., Ltd, that includes--
(A) a categorical breakdown of annual unit
production volume and technical specifications,
including minimum feature size, throughput, and defect
rate, of all major equipment classes installed or under
development for wafer production in foundries in China,
including--
(i) lithography tools, including
photolithography, nanoimprint, and electron
beam lithography tools;
(ii) etch equipment, including wet etching
and dry etching;
(iii) deposition equipment, including
chemical vapor deposition, physical vapor
deposition, and atomic layer deposition;
(iv) cleaning systems;
(v) chemical mechanical planarization
tools;
(vi) ion implantation and diffusion
systems;
(vii) wafer inspection, metrology, and
process control tools;
(viii) back-end packaging equipment,
including wafer dicing equipment and wire
bonders;
(ix) capabilities and advancements in
advanced packaging technologies;
(x) thermal processing equipment;
(xi) bonding equipment, including thermo
compression bonders and hybrid bonders;
(xii) environmental control systems;
(xiii) laser systems; and
(xiv) reticle and photomask writing and
inspection tools;
(B) the country of origin and supplier company for
each piece of semiconductor manufacturing equipment
used in foundries in China for advanced-node logic or
high-bandwidth memory production by such companies;
(C) the foreign-sourced subcomponents integrated
into the semiconductor manufacturing equipment produced
by such companies, including precision motion stages,
lasers, electrostatic chucks, optical systems, radio
frequency generators, or extreme-purity gas handling
systems;
(D) collaborations, licit or illicit, between
Chinese firms or their subsidiaries and non-Chinese
firms and the advancements those collaborations produce
for the Chinese firm;
(E) progress Chinese firms are making at
indigenizing export controlled technologies;
(F) market share Chinese firms have in China and
internationally; and
(G) year-over-year trends in leading semiconductor
manufacturing equipment companies in China for a
minimum of the 5 previous years.
(5) An assessment of electronic design automation (EDA)
software used in the design of integrated circuits for advanced
artificial intelligence applications in China, including
software developed or provided by leading Chinese EDA companies
such as Empyrean Technology Co., Ltd. and Primarius
Technologies Co., Ltd., that includes--
(A) with respect to such software tools, the--
(i) range of design stages supported,
including front-end design such as architecture
and register-transfer level design, logic
synthesis, verification, physical design,
place-and-route, timing closure, and final
signoff;
(ii) compatibility with advanced process
nodes, including sub-7 nanometer technologies,
gate-all-around devices, and three-dimensional
integration;
(iii) capabilities for designing artificial
intelligence-specific components of such
integrated circuits, including tensor
processing cores, systolic array processing
units, matrix multiplier units, and high-
bandwidth memory interfaces;
(iv) ability to model and optimize for
power, performance, and thermal constraints in
artificial intelligence workloads;
(v) scale and performance of the software
in handling large designs, such as chips
exceeding 50-100 billion transistors; and
(vi) integration with cloud compute
resources or distributed workflows for large-
scale artificial intelligence chip development;
(B) with respect to such companies, the--
(i) total market share within China and
internationally, including the share of
advanced-node integrated circuits designed or
optimized for advanced artificial intelligence
training or inference designs supported by each
company; and
(ii) types, volume, and origin of critical
technology components used in software
development, including intellectual property
cores, third-party libraries, verification
suites, and artificial intelligence-assisted
optimization algorithms;
(C) progress Chinese firms are making at
indigenizing export-controlled or foreign-origin
technologies used in EDA, including high-performance
computing integration, advanced verification engines,
and proprietary intellectual property cores;
(D) year-over-year trends for China's EDA industry
over a minimum of the previous 5 years, including
technology adoption, market share, and software
capability evolution; and
(E) identification of technical gaps relative to
leading global EDA providers, particularly in relation
to artificial intelligence-focused design, advanced
nodes, and large-scale verification.
(6) An assessment of the advanced artificial intelligence
models determined by the Secretary to be the most relevant to
the national security of the United States that were developed
by artificial intelligence laboratories or companies based in
China, especially those laboratories and companies affiliated
with the People's Liberation Army or any university in China,
including the most advanced models, open-weight and closed-
weight models, based on model size, total compute used during
training, benchmark performance, and any other advanced
capabilities the Secretary determines relevant, that includes,
with respect to each such model--
(A) the number of model parameters;
(B) the total training compute used, measured in
floating-point operations and their relevant precision
level;
(C) the model performance on benchmark tasks;
(D) an evaluation of the extent to which the model
exhibits advanced cyber offensive capabilities, an
advanced understanding of biological and virological
application domains, and the ability to substantially
automate or accelerate artificial intelligence
research, and a comparison of such models to the most
advanced artificial intelligence models from United
States developers;
(E) if the model is open-weight, an evaluation of
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